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  ? semiconductor components industries, llc, 2007 january, 2007 ? rev. 3 1 publication order number: mbrs4201t3/d mbrs4201t3 200v, 4a schottky fast soft?recovery power rectifier smc power surface mount package features ? lower forward voltage than any ultrafast rectifier: v f < 0.61 v at 150 c ? fast switching speed: reverse recovery time (t rr ) < 35 ns ? soft recovery characteristics: softness factor (t b /t a )  1 ? highly stable over temperature ? pb?free package is available benefits ? significantly reduced emi ? eliminates the need of snubber circuits ? low switching and heat losses ? improved thermal management applications ? engine and convenience control systems ? motor controls ? battery chargers and switching power supplies mechanical characteristics ? small compact surface mount package with j?bend leads ? rectangular package for automated handling ? weight: 217 mg (approximately) ? finish: all external surfaces corrosion resistant and terminal leads are readily solderable ? lead and mounting surface temperature for soldering purposes: 260 c maximum for 10 seconds ? polarity: notch in plastic body indicates cathode lead maximum ratings characteristic symbol value unit peak repetitive reverse voltage working peak reverse voltage dc blocking voltage v rrm v rwm v r 200 v average rectified forward current (rated v r , t l = 70 c) i f(av) 4 a nonrepetitive peak surge current (surge applied at rated load conditions halfwave, single phase, 60 hz) i fsm 100 a operating junction temperature t j ?55 to +150 c stresses exceeding maximum ratings may damage the device. maximum ratings are stress ratings only. functional operation above the recommended operating conditions is not implied. extended exposure to stresses above the recommended operating conditions may affect device reliability. http://onsemi.com device package shipping ? ordering information mbrs4201t3 smc 2500 / tape & ree l schottky rectifier 4 amps, 200 volts ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our tape and reel packaging specification brochure, brd8011/d. b421 = specific device code a = assembly location y = year ww = work week  = pb?free package (note: microdot may be in either location) ayww b421   marking diagram smc case 403 plastic mbrs4201t3 smc 2500 / tape & ree l MBRS4201T3G smc (pb?free)
mbrs4201t3 http://onsemi.com 2 thermal characteristics characteristic symbol value unit thermal resistance, junction?to?lead r  jl 11 c/w electrical characteristics characteristic symbol value unit maximum instantaneous forward voltage (i f = 4 a, t j = 25 c) (i f = 4 a, t j = 150 c) v f 0.86 0.61 v maximum instantaneous reverse current (rated v r ) (rated dc voltage, t j = 25 c) (rated dc voltage, t j = 150 c) i r 1.0 5.0 ma ma maximum reverse recovery time (i f = 1.0 a, di/dt = 100 a/  s, v r = 30 v) t rr 35 ns 0.1 1 10 100 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 1.1 1 .2 v f , instantaneous voltage (v) i f , forward current (a) figure 1. typical forward voltage 25 c 150 c 100 c 0.1 1 10 100 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 1.1 1.2 25 c 150 c 100 c v f , instantaneous voltage (v) i f , forward current (a) figure 2. maximum forward voltage figure 3. typical reverse current v r , reverse voltage (v) i r , reverse current (a) figure 4. maximum reverse current 0 20 40 60 80 100 120 140 160 180200 1e?9 1e?8 1e?7 1e?6 1e?5 1e?4 1e?3 1e?2 1e?1 100 c 150 c 25 c 1.0e?06 160 0 20 40 60 80 100 v r , reverse voltage (v) 120 140 180 20 0 i r , maximum reverse current (a) t c = 25 c t c = 150 c 1.0e?05 1.0e?04 1.0e?03 1.0e?02 1.0e?01
mbrs4201t3 http://onsemi.com 3 1 10 100 1000 0 20 40 60 80 100 120 140 160 180 200 c, capacitance (pf) v r , reverse voltage (v) figure 5. typical capacitance 0 1 2 3 4 5 6 7 0 20 40 60 80 100 120 140 160 i f , average forward current (a) t l , lead temperature ( c) figure 6. derating curve dc squarewave p fo , average power dissipation (w) i o , average forward current figure 7. power dissipation 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 01 2 3 4 5 6 dc squarewave t, time (10 ns/div) i, current (a) ?2.5 ?2.0 ?1.5 ?1.0 ?0.5 0 0.5 1.5 2.0 2.5 1.0 figure 8. reverse recovery time* (t rr ) at 125  c 200 v ultrafast *test conditions: i f = 1 a, d i /d t = 100 a/  s, v r = 30 v mbrs4201 on semiconductor mbrs2401 eliminates reverse recovery oscillations present in ultrafast devices in the market, particularly a t hot temperatures.
mbrs4201t3 http://onsemi.com 4 package dimensions smc case 403?03 issue e dim a min nom max min millimeters 1.90 2.13 2.41 0.075 inches a1 0.05 0.10 0.15 0.002 b 2.92 3.00 3.07 0.115 c 0.15 0.23 0.30 0.006 d 5.59 5.84 6.10 0.220 e 6.60 6.86 7.11 0.260 l 0.76 1.02 1.27 0.030 0.084 0.095 0.004 0.006 0.118 0.121 0.009 0.012 0.230 0.240 0.270 0.280 0.040 0.050 nom max 7.75 7.94 8.13 0.305 0.313 0.320 h e 4.343 0.171 3.810 0.150 2.794 0.110  mm inches  scale 4:1 *for additional information on our pb?free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* e bd c l1 l a1 a notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. d dimension shall be measured within dimension p. 4. 403?01 thru ?02 obsolete, new standard 403?03. h e 0.020 ref 0.51 ref l1 on semiconductor and are registered trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to mak e changes without further notice to any products herein. scillc makes no warranty, r epresentation or guarantee regarding the suitability of its products for an y particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/or specifications can and do vary in different application s and actual performance may vary over time. all operating parameters, including ?typicals? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the scillc product could create a sit uation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indemnify and hold scillc and its of ficers, employees, subsidiaries, af filiates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. publication ordering information n. american technical support : 800?282?9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81?3?5773?3850 mbrs4201t3/d literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303?675?2175 or 800?344?3860 toll free usa/canada fax : 303?675?2176 or 800?344?3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your local sales representative


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